Next generation sputtering deposition systems series TFDS-840, 842 are flexible completely customizable magnetron sputtering systems designed specifically for R&D and prototype production. Multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum and reactive sputtering (with active gas mixtures) are possible.
TFDS-842 is the most compact sputtering system with minimal footprint, while TDFS-840 is a compact-configuration with a load-lock chamber.
Features:
- Electro-polished stainless-steel chamber (D shaped Box)
- 4” Diameter viewport on front door with manual shutter
- Additional spare ports/ flanges for future upgrades
- Dry scroll pump (per request - dual stage rotary vane pump)
- Cryo pumping or turbo-molecular vacuum pumping system
- Cold-cathode or hot cathode ionization gauge
- Throttle gate-valve
Load-lock with:
- Manual/automatic sample transfer system
- UV cleaning
- Controlled oxygen inlet
- Sample rotation
- Sample controlled heating/cooling
- Pneumatically operated gate-valve
- Turbo-molecular pumping-system
- Single/multiple magnetron gun assemblies with various target sizes
- The stand-alone guns with special mounting enable angular and high adjustment
- Targets are indirect cooled
- Cooling water is not in contact with the magnets or with applied cathode power
- DC / RF sputtering deposition of magnetic, non-magnetic metals or insulators
- Easy target mounting
- DC, DC pulsed, RF or HiPIMS power supplies
- Blocked filters for DC power supplies
- High-voltage switch box
- Motorized shutter assembly for each source
- Up to 4-gas inlets with mass flow controllers
- Substrate pre-cleaning by Ion-source
- Substrate rotation
- Substrate heater (from RT up to 800°C)
- Programmable adjustable substrate height before or during deposition (Z-shift)
- PC /PLC controlled system
